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MC9S12XEP100MVL

NXP USA Inc.

Manufacturer Part #:

MC9S12XEP100MVL

Manufacturer:

NXP USA Inc.

Package:

208-BGA (17x17)

Datasheet:

Description:

IC MCU 16BIT 1MB FLASH 208MAPBGA

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Specifications

Product Details

Mfr	NXP USA Inc.
Speed	50MHz
Series	HCS12X
Package	Tray
RAM Size	64K x 8
Core Size	16-Bit
EEPROM Size	4K x 8
Peripherals	LVD, POR, PWM, WDT
Connectivity	CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Mounting Type	Surface Mount
Number of I/O	152
Core Processor	HCS12X
Package / Case	208-BGA
Product Status	Active
Data Converters	A/D 32x12b
Oscillator Type	External
Base Product Number	MC9S12
Program Memory Size	1MB (1M x 8)
Program Memory Type	FLASH
DigiKey Programmable	Not Verified
Operating Temperature	-40°C ~ 125°C (TA)
Supplier Device Package	208-BGA (17x17)
Voltage - Supply (Vcc/Vdd)	1.72V ~ 5.5V

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