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BDN10-3CB/A01

CTS Corporation

Manufacturer Part #:

BDN10-3CB/A01

Manufacturer:

CTS Corporation

Package:

Datasheet:

Description:

HEATSINK CPU W/ADHESIVE 1.01"SQ

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Specifications

Product Details

Mfr	CTS Thermal Management Products
Type	Top Mount
Shape	Square, Pin Fins
Width	1.010" (25.65mm)
Length	1.010" (25.65mm)
Series	BDN
Package	Box
Diameter	-
Material	Aluminum
Fin Height	0.355" (9.02mm)
Shelf Life	24 Months
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Included)
Base Product Number	BDN10
Thermal Resistance @ Natural	26.40°C/W
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	8.00°C/W @ 400 LFM

User Guide

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IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.