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558-10-560M33-001104

Preci-Dip

Manufacturer Part #:

Manufacturer:

Preci-Dip

Package:

Datasheet:

Description:

BGA SURFACE MOUNT 1.27MM

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Product Details

Mfr	Preci-Dip
Type	BGA
Series	558
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Mounting Type	Surface Mount
Pitch - Mating	0.050" (1.27mm)
Product Status	Active
Housing Material	FR4 Epoxy Glass
Contact Resistance	10mOhm
Base Product Number	558-10
Contact Finish - Post	Gold
Current Rating (Amps)	1 A
Operating Temperature	-55°C ~ 125°C
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.086" (2.20mm)
Contact Material - Mating	Brass
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Number of Positions or Pins (Grid)	560 (33 x 33)

User Guide

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.