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550-10-560M33-001166

Preci-Dip

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Manufacturer:

Preci-Dip

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Datasheet:

Description:

BGA PIN ADAPTER 1.27MM SMD

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Product Details

Mfr	Preci-Dip
Type	BGA
Series	550
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Mounting Type	Through Hole
Pitch - Mating	0.050" (1.27mm)
Product Status	Active
Housing Material	FR4 Epoxy Glass
Contact Resistance	10mOhm
Base Product Number	550-10
Contact Finish - Post	Gold
Current Rating (Amps)	1 A
Operating Temperature	-55°C ~ 125°C
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.098" (2.50mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Number of Positions or Pins (Grid)	560 (33 x 33)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.